Research
Title : | Low-cost Additive Manufacturing Technique for Fabricating Through-Substrate Vias based three-dimensional micro-structures used in MEMS Applications |
Area of research : | Engineering Sciences, Material Sciences |
Focus area : | Additive Manufacturing Processes Demonstrated Application of Manufacturing Technologies and Strategies in Other Sectors such as Mechatronics (including MEMS), Electrical & Electronics, Textile, Biomedical, etc. Machines and Tooling for Manufacturing Applications Manufacturing Systems, strategies and Best Practices Precision and Ultra Precision Manufacturing Surface Modification and Finishing Processes |
Principal Investigator : | Prof. Pradeep Dixit, Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology (IIT), Mumbai |
Contact info : | pradeep.dixit@iitb.ac.in, ssjoshi@iitb.ac.in, usha.cmti@nic.in |
Details
Executive Summary : | With increasing usage of Micro-electro-mechanical-systems (MEMS) devices in smart hand-held consumer electronics, fabrication of 3D microstructures and their subsequent packaging has become very important. This proposal aims to develop a low cost electrodeposition based additive manufacturing to create 3D microstructures, such as inductors required in MEMS applications. The fabricated 3D inductors by the proposed method will have reduced foot-print area and shorter electrical interconnect compared to conventional planer inductors. In these inductors, front-side structures will be connected to the back-side structures by metal-filled vias known as through-substrate vias. A low cost Electro-chemical-discharge-machining (ECDM) process capable of creating multiple vias in non-conductive semiconductor substrates will be demonstrated. Conductive metals such as copper, will be deposited in these vias by bottom-up electrodeposition. Dry-polymer lamination and spin-coated through-photoresist based electrodeposition will be used to create front and backside metallic structures. Characterization and reliability analysis of metal-filled TSV will also be performed. |
Co-PI: | Prof. Suhas S Joshi, Dean Alumni & Corporate Relations, Department of Mechanical Engineering, Indian Institute of Technology (IIT), Mumbai, S. Usha, Joint Director, Central Manufacturing Technology Institute (CMTI), Bengaluru |
Total Budget (INR): | 1,45,38,000 |