Patents

IN233097: A process for diffusion soldering

The invention relates to a process for brazing of copper-impregnated graphite with self and with other materials like copper, monel, nickel, kovar, and metallised alumina. The invention provides a relatively simpler and low temperature (<1000°C) brazing of copper-impregnated graphite DFP-1C graphite with other materials using Ag-Cu eutectic brazing alloy (779°C) in paste form, in atmosphere of H2:N2 mixture in the ratio of 8:92. The process is particularly useful for brazing collector electrodes in the multi stage depressed collector assembly of a TWT, with the high voltage metallized alumina insulators and also with self.

Filing Date: 27-03-2002

Issue Date: 26-03-2009

Applicant: Satish Kumar Bhatnagar, H.C. Wolfgang Gust, Pramod Kumar Khanna, Eric J. Mittemeijer, Eng. Silvana Sommadossi

Patent No: IN233097

Application No: 0354DEL2002

IPC Classification: B23K31/02

Country: India

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