Executive Summary : | The demand for miniaturized lightweight heat dissipation devices with effective heat transfer characteristics persists because of the rising energy consumption, the necessity for high efficiency, and the limitations of space and materials. The widespread use of micro or mini-channels in today's interdisciplinary sectors has led to new and distinct needs for micro or mini-channels in the course of practical implementation, including design, working fluid, operating conditions, etc. The aim of this project is to develop a micro or mini-channels based heat dissipation device for the thermal management of electronic equipment. The major challenge in the development of such devices is the manufacturing of micro-features such as micro-channels, ribs, cavities, etc. Micro-EDM die-sinking is one of the leading techniques to fabricate micro-features. In this project a novel universal die will be fabricated which will be used for the fabrication of micro-channels. This die will solve the problem of slow machining time of micro-EDM as multiple male micro-features, in terms of ribs, can be inserted into the die which will create desired number of micro-channels simultaneously. The die will also provide the different variations in the micro-channel's geometry such as different orientation angles, lengths and widths. After the fabrication of the die, a novel nature inspired configuration of micro or mini-channels will be manufactured on a good thermal conductive metallic substrate. Topographic analysis of the fabricated micro or mini-channels will be done to ensure its dimensional accuracy and surface quality. An in-house test-rig will be also developed for the thermo-hydraulic performance testing of the device. At last, CFD modelling of the device and its validation with the experimental results is also proposed in the project. |