Technologies

Physical Sciences

Title:

Lead-Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer

Area:

Physical Sciences

Focus Area:

Electroplating

Social Benefits:

Good mechanical properties , Eliminating hazardous Pb in the alloy composition (Lead free process) , Good cathodic current efficiency , Good plating rate , Simplest process.

Developing Agency:

CSIR-Central Electro Chemical Research Institute (CECRI), Tamil Nadu

Technology Readiness Index:

Technology Demonstration

Email:

director@cecri.res.in
Website Link :http://www.cecri.res.in
Source (more info) :https://t.ly/l_sb

Brief Description

Description :

Used for bearings.

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