Technologies
Title: | Lead Free Electroplating Process for Cu-Sn Alloy and Ag-Bi Bilayer |
Area: | Chemical Sciences |
Focus Area: | Industrial appliances |
Developing Agency: | CSIR-Central Electro Chemical Research Institute(CECRI), Karaikudi |
Technology Readiness Index: | Technology Demonstration |
Brief Description
Description : | The plated Cu-Sn alloy and Ag-Bi bilayer gives good mechanical properties than Cu-Pb-Sn alloy for bearing applications. With this technology we can eliminate hazardous Pb in the alloy compositions. The technology provide good mechanical properties and plating rate. |